Products

LTCC substrate green sheets made by Yamamura Photonics can be baked at low temperatures of 900°C or less, they feature high strength and high dimensional stability, and are used for a wide range of applications including high frequency circuit boards, automotive use, and LED substrates. This product can be offered in the color that fits the application, and the environment is considered through the elimination of any lead content.

YAMAMURA Photonics developed Flat window caps for semiconductor laser packaging by our GTMS technology. In 1980's. They can air-tightly seal glass/lens/crystal glass/sapphire on metal surface. The major applications of this technology are the fiber communication, laser beam printers, and others. 

YAMAMURA Photonics' GTMS technology creates UV-LED for semiconductor UV device. Glass windows are directly attached on the metal shell without any glue for low profile and high power packaging.
The flat design of glass LID makes low profile packaging. Various AR coating on glass surface is possible to pass dedicated wave length light. Window material can be selected from our original KC glass, Sillica glass, sapphire, etc.

A variety of LED characteristics of chips, including wavelength and output, can be measured and the chips sorted based on the results.

The Igetalloy® microdrills made by Sumitomo Electric Tool Net encompass a wide collection of items from Φ2 shanks to small diameter drills. They employ a diversity of technologies in the tooth shape and finish, and satisfy customer's needs through stable accuracy and quality based on stringent quality control.

Tungsten and molybdenum wire processing to stick pins, also we can supply the probe pin to be used for semiconductor inspection at the material and processing to your needs.

HITACHI METALS,Ltd offers clad material that contributes to improved characteristics for semiconductor devices, PCs and DVDs, like smaller size, higher performance, higher speed, and higher cooling capability. They also provide various types of processing materials (lead pins for MPU and copper-core solder balls) with high capacity and high quality achieved through highly accurate processing technology, and lid material for use in ceramic package seals for crystal devices.

POREFLON® (Sumitomo Electric Fine Polymer) is a porous membrane material manufactured through a unique processing technology that converts fluorinated resin, with its excellent heat-resistance and chemical characteristics, into a flexible fibrous structure. POREFLON® modules are made by incorporating POREFLON® tubes into a filtration module and they are used in various applications, such as membrane distillation, deaeration, and gas dissolution, as well as sterile filtration, clarification, and wastewater treatment.

POREFLON® (Sumitomo Electric Fine Polymer) is a porous membrane material manufactured through a unique processing technology that converts fluorinated resin, with its excellent heat-resistance and chemical characteristics, into a flexible fibrous structure. POREFLON® modules are made by incorporating POREFLON® tubes into a filtration module and they are used in various applications, such as membrane distillation, deaeration, and gas dissolution, as well as sterile filtration, clarification, and wastewater treatment.

 Sumitomo's Tab Lead is the things which use  exterior  Aluminum laminate film as exterior and take out of the electricity from Lithium ion battery and electric double layer capacitor. In addition to excellent electrolytic solution resistance, by having an insulating layer suppressing thermal deformation to have high reliability packaged product, in order to use in daily commodities and automotive product.

Aluminum nitride (AlN) is a new ceramic material that excels in thermal conductivity and displays high strength, low thermal expansion, low conductivity and a low induction rate.

 USB is the new generation cable. The biggist transferring 10Gbps and Power Derivery may become 100W. By having using coaxial for high speed wiring, it could be a very flexible cable. From now on, it might be widely used in Laptop、Tablet、Smartphone and peripheral equipments.

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